• Navigation

    • Welcome Message
    • Committees
    • Proceedings
  • Conference Organizing Committee

    General Chair

    Thomas F. Wiener

    General Vice-Chair

    Andrei Shkel

    Treasurer

    Christina M. Schober

    Exhibit and Publicity Chair

    John Vig

    Publications Chair

    Andrei Shkel

    Tutorial Chair

    Michiel Vellekoop

    Local Arrangement Chair

    Victor Chupil

    Technical Program Committee

    Technical Program Chair

    Lina Sarro

    Program co-Chair - Americas

    William Hunt

    Program co-Chair – Asia and Pacific Rim

    Sukhan Lee

    Program co-Chair – Europe and Africa

    Bernhard Jakoby

    Reviewer List

    • Gert Andersson, IMEGO, Sweden
    • Kris Baert, IMEC, Belgium
    • Minhang Bao, Fudan University, China
    • Marc Bendahan, Univeristy of Marseille, France
    • Ewald Benes, Technical University of Vienna, Austria
    • Carles Cane, CNM, Spain
    • Kukjin Chun, Seoul National University, Korea
    • Marina Cole, University of Warwick, UK
    • Dan Dascalu, IMT, Roemenia
    • Bernard Diem, CEA, France
    • Masayoshi Esashi, Tohoku University, Japan
    • Alan Evans, University of Southampton, UK
    • Gerald Gerlach Dresden, University of Technology, Germany
    • Bahram Ghodsian, Biogenik Technologies Inc., USA
    • Martin Gijs, EPFL, Switzerland
    • Pedro Girão, Lab Medidas Electricas, Portugal
    • Sheila Grant, University of Missouri-Columbia, USA
    • Anne-MarieGue, LASS, France
    • Gabor Harsanyi, Budapest University of Technology, Hungary
    • Peter Hauptmann, University of Magdeburg, Germany
    • Andreas Hierlemann, ETHZ, Switzerland
    • Star Huang, National Tsing Hua University, Taiwan
    • Qing-An Huang, South Eastern university, China
    • Ryszard Jachowicz, Warsaw University of Technology, Poland
    • Shoji Kawahito, Shizuoka University, Japan
    • Taesong Kim, KIST, Korea
    • Kevin Kornegay, Cornell University, USA
    • Jan Korvink, IMTEK, Germany
    • Milena Koudelka-Hep, University of Neuchatel, Switzerland
    • Anders Kristensen, MIC, Denmark
    • Reinhard Lerch, University of Erlangen-Nuremberg, Germany
    • Xinxin Li, SIMSIT, Shanghai, China
    • Chang Liu, University of Illinois Urbana-Champaign, USA
    • Anita Lloyd, Spetz Linköping University, Sweden
    • Kofi Makinwa, Delft University of Technology. The Netherlands
    • Andrew Mason, Michigan University, USA
    • Ryutaro Mayeda, National Institute of Advanced Industrial Science and Technology, Japan
    • Gerard Meijer, Delft University of Technology. The Netherlands
    • Chris Merveille, INASMET, Spain
    • Boris Mizaikoff, Georgia Institute of Technology, USA
    • Janos Mizsei, Budapest University of Technology, Hungary
    • Wilfried Mokwa, RWTH Aachen, Germany
    • Sang-Rok Oh, KIST, Korea
    • Robert Okojie, NASA-Gleen Cleveland, USA
    • Takahito Ono, Tohoku University, Japan
    • Ramón Pallás-Areny, Universitat Politécnica de Catalunya, Spain
    • Thomas Papakostas, Tekscan Inc., USA
    • Jaques Pistre, University of Bordeaux, France
    • Michael Rapp, Research Center Karlsruhe, Germany
    • Don Reago, US Army CECOM, USA
    • Pavel Ripka, Czech Technical University, Czech Republic
    • Chavdar Roumenin, University of Bucharest, Romenia
    • Giorgio Sberveglieri, University of Brescia, Italy
    • Oliver Schatz, Robert Bosch GmbH, Germany
    • Xia Shanhong, Chinese Academy of Science, China
    • Andrei Shkel, University of California Irvine, USA
    • Michael Shur, RPI, USA
    • Pietro Siciliano, IME-CNR, Italy
    • Priptal Singh, University of Villanova, USA
    • Hiroaki Suzuki, University of Tsukuba, Japan
    • Bill Tang, University of California Irvine, USA
    • Francis E. H. Tay, National university of Singapore, Singapore
    • Kazuhiko Tsutsumi, Mitsubishi, Japan
    • Gerald Urban, IMTEK, Germany
    • Chris Van Hoof, IMEC, Belgium
    • Michiel Vellekoop, Technical University Vienna, Austria
    • John Vig, US Army CECOM, USA
    • Denise Wilson, University of Washington, USA
    • Wojtek Wlodarski, RMIT University, Australia
    • Darrin Young, Case Western Reserve University, USA
    • Hans Zappe, IMTEK, Germany
    • Wendang Zhang, North-East china University of Science & Technology, China
    • Yinian Zhu, Nanyang Technological University, Singapore
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